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In the CMP process, a regeneration technology for polishing pads that can significantly reduce costs has been developed.
A polishing pad regeneration technology has emerged that can significantly reduce costs in the semiconductor planarization (CMP) process.
New shape hub vortex diffusion propeller cap, approximately 3% energy-saving effect.
The hub vortex generated at the rear end of the cap due to the circumferential flow originating from the propeller's trailing edge causes energy loss. In an effort to diffuse the hub vortex and recover the loss, over 500 different cap shapes were tested and designed, ultimately showing the most effectiveness with a cap shape equipped with multiple wings, which became the prototype for the ECO-Cap.
